cyberTECHNOLOGIES CT300: The Swiss Army Knife (SAK) of Optical Metrology
This webinar introduces the high-speed, high-resolution imaging capabilties of cyberTECHNOLOGIES’ CT300 profilometer, which facilitates non-destructive, non-contact surface profiling of up to full 300-mm wafers with a vertical resolution < 5 nm.
If those numbers seem unreal, they’re certainly unprecedented. Join us in the live webinar event for a look ‘under-the-hood’ into this Swiss army knife (SAK) of optical metrology. The talk will explore how the CT300 employs both microscopy and profilometry detection methods to empower device R&D.
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What this webinar will cover
- How does the CT300 work? How are images and height maps captured?
- What makes the CT300 unique?
- What detectors are used for what purposes in the CT300?
- How is the CT300 used for process control and optimization in industry?
- What are some examples of the unique applications the CT300 can accommodate?
Unprecedented combination of speed, scale, and resolution…
CyberTECHNOLOGIES’ CT300 combines confocal microscopy with the potent vertical resolution of 3D chromatic white light interferometry to achieve unprecedented vertical resolution limits while maintaining a wide field of view. Even better, its finely controlled stage and flexible, multi-sensor array achieve a data rate of up to 4 KHz: making it possible to capture up to 10,000 x 10,000 data points in minutes.
The CT300 is a premium non-contact profilometry system facilitates analysis of whole-wafer topology (warp and bowing), mapping surface roughness and uniformity of serial chiplets or sensor devices, and making critical dimension measurements on printed circuits, components, and packaging. In addition to explaining how the tool works, this webinar will also showcase several examples of how it’s used to achieve unique insights for process optimization and control.